Shenzhen Crescent Optoelectronic Co., Ltd.
Exhibition
What is cob Package?
COB package the full name is chips on board, it is a technology to solve the problem of heat dissipation of LED. Compare...
Packaging Differences and Advantages of SMD and COB
In the production of led, there are different packaging technologies, including cob led and SMD led. What is the differe...

Quality Control

Supplier Audit

Supplier Audit

We are quite strict with our suppliers, including the suppliers' enterprise qualification, production capacity, quality system control, quality assurance of raw materials, technical force, supply cycle, transportation and freight, as well as quality problems in the future, its response speed, service status, and evaluation of cooperation results.

The raw material qualit inspection


Supplier auditSupplier audit

The Raw Material Quality Inspection

The raw material quality inspection mainly is the bracket inspection and the chip inspection.

Control the raw material quality inspection, Minimize risks, save costs and time, and ensure quality to your final customers.


Bracket inspection


1. Appearance inspection: visual method, magnifying glass (4-10 times).
2. Adhesion test of silver coating: bending method, tape method or combination method.
3. Solder test: tin dip method, generally more than 95% of the tin dip area is uniform and smooth.
4. Steam aging test: test for discoloration or corrosion spots and subsequent weldability.
5. Anti-discoloration test: use oven baking method, whether discoloration or peeling.
6. Corrosion resistance test: salt spray test, nitric acid test, sulfur dioxide test, hydrogen sulfide test.


Chip inspection


1. Performance test of chip parameters.
2. Chip defect detection (dimension measurement, electrode size, grain breakage and cutting size).
3. Chip epitaxial defect detection.
4. Chip process and cleanliness observation.


Chip inspection


Process Control

A. Chip Bonding

Chip Bonding

1. Before chip bonding, use automatic plating machine and plasma cleaning machine to ensure the consistency and surface cleaning of the bracket.
2. Operators use high/low power microscopy to check and analyze the height, position and glue content of chip bonding.
3. Operators use an automatic push-pull machine to test the adhesion of the solidified crystal and calculate the CPK value.
4. Use thermometer to test the solidification temperature to ensure the consistency and uniformity of the temperature.

B. Wire Bonding

1. Operators use plasma cleaning machine to clean the surface of support;
2. Operators use high/low power microscope to check and analyze the arc, height, diameter and ball diameter of welding wire.
3. Operators use an automatic push-pull machine to test the pull force of the gold wire after welding and the push force of the bonding of the gold ball.

Wire Bonding

Wire Bonding

C. Glue pouring

1. Operators use plasma cleaning machine to clean the surface of support;
2. Engineers use high-precision electronic scales to weigh phosphor and silica gel and mix them.
3. Operators use machine to test photoelectric parameters before baking and after glue poured to ensure the consistency of photoelectric parameters.
4. Operators use a high/low power microscope to examine the appearance of goods after glue poured.

Glue pouring

Glue pouring


D. Roller-type stripping

Roller-type stripping

1. Operators use high/low power microscopy to examine and analyze burrs and scratches after roller-type stripped step.
2. Operators use thermometers to control oven temperature.
3. Operators use pure water to prevent surface contamination.

E. LED sorting


1. Operators use high/low power microscopes to detect sundries and bubbles after LED sorted.
2. Operators use integral sphere and spectrophotometer to compare the test data and control the calibration.
3. Operators use integral spheres to control the photoelectric parameters of the spectrometer.

LED sorting

LED sorting

F. Taping

Taping

1. Operators use high/low power microscopy to check and analyze the air bubbles, debris, dislocation and leakage after braiding.
2. Operators use integral spheres to sample photoelectric parameters to ensure the conformity of BIN files.
3. Operators use high temperature and humidity testing machine, cold and hot shock testing machine and aging testing instrument to control the performance of products.

G. Warehousing


1. Select a certain proportion of samples and test the appearance and photoelectric properties of the products to ensure that they meet the requirements of the standards.
2. Check the number of packages, label specifications, product specifications and product codes;
3. Use antistatic bags, desiccants, vacuum sealing machines to ensure the conformity of product packaging;

Warehousing

Warehousing

Outgoing goods inspection

Outgoing goods inspection

1. Sampling test and control of photoelectric properties of products by integrating spheres;
2. Sampling control of product appearance and other items according to high/low power microscope;
3. Check the shipment inspection report, shipment specifications, shipment quantity, packaging specifications and other items again; Operators uses an automatic push-pull machine to test the adhesion of the solidified crystal and calculate the CPK value.