XY14D Flip COB LED

Advantages of Flip Chip LED Package over formal Packaging:

• The COB light source is connected by gold wires inside, the dense and fragile gold wires are easily damaged by external force, as well as expansion and contraction of the colloid, then to be broken. There is no such worry for Reverse XY14D COB, it has obvious advantages in reliability.
• The chip heat dissipation in formal COB is through the solid crystal glue, then flow to the substrate. In reverse XY14D, the chip and solder paste directly from an alloy, then heat is dissipated directly by the substrate. Compared with the formal packaging, the heat dissipation is better, and the thermal resistance is lower for reverse packaging.
• The same size reverse XY14D can withstand higher driving current than formal XY14D, so as to achieve higher density at the same package size (small luminous surface) and concentrated irradiation Angle.
  
  

Therefore, reverse XY14D performances better than formal packaging in 5-18w lamps, whose working condition is dark, humid, high temperature and so on.

Presently, we have two sizes of reverse packaging products: XY14D and XY19D.

Specification

XY14D(XY1021) Product Code	Color Temperature（mm)	Common color temperature and code	Color Rendering Index（Ra)	Forward Voltage（v）	Current(mA)
XY14D/5W	11	5400K±250K(S-8） 3900K士150K（S－7） 3000K±100K(S-6)	80/90	30-34	150
XY14D/7W				42-48
XY14D/12W				72-82
XY14D/15W				90-102

XY19D Product Code	Color Temperature(mm)	Common color temperature and code	Color Rendering Index（Ra)	Forward Voltage(v)	Current(mA)
XY19D/18W	16.5	5400K±250K(S-8） 3900K士150K（S－7） 3000K±100K(S-6)	80/90	108-122	150
XY19D/24W				72-82	300
XY19D/30W				90-102
XY19D/35W				105-120

Applications for Reverse packaging XY14D and XY19D